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Heat spreader - List of Manufacturers, Suppliers, Companies and Products

Heat spreader Product List

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High Thermal Conductivity Product Series

Solve the problems of strict temperature control and high efficiency! A range of high thermal conductivity products exceeding 1000 W/m-K.

The "High Thermal Conductivity Product Series" consists of products developed using highly oriented graphite TPG and sealing/metallization technology, with thermal conductivity exceeding 1000 W/m-K. These products are ideal for heat dissipation and cooling of control boards and semiconductor devices, as well as for eliminating heat spots. 【Product Examples】 ■ Heat spreader for substrate cooling: TC-1050 ■ Thin laminate: TMP-FX ■ Heat sink for chip cooling: TMP-EX *For more details, please refer to the catalog. Feel free to contact us with any inquiries.

  • Other electronic parts

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Paste technology

We offer products with heat dissipation properties that have heat spreaders attached using metal plate bonding technology!

Nippon Micron Co., Ltd. offers products with heat dissipation properties by applying heat spreaders using our unique metal sheet bonding technology. By appropriately selecting materials and establishing proper bonding conditions with heat spreaders/Cu foils, we can achieve products with extremely low warpage. Additionally, by bonding rigid substrates with sealing frames and rigid substrates with Cu foils, we can realize package structures that are difficult to achieve with conventional multilayer designs. 【Features】 ■ Proven track record in bonding heat spreaders/Cu foils ■ Achieves high heat dissipation ■ High freedom in height and width, ensuring stable shapes *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts

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High thermal conductivity products exceeding 1000 W/m-K, solving efficiency issues!

Introducing high thermal conductivity products that can address heat dissipation under severe conditions and eliminate hotspots in high heat generation areas!

Our company has developed a range of high thermal conductivity products using highly oriented graphite TPG and sealing/metallization technology. These products can be used in various applications such as heat dissipation/cooling for electronic substrates, LEDs/LDs, semiconductor chips, molds, high-performance heat sinks, medical devices, thermal straps, and high-performance heat spreaders to eliminate heat spots and control temperature. We maximize the performance of each product under harsh conditions and contribute to longer lifespans! 【Features】 ■ High thermal conductivity products exceeding 1000 W/m-K ■ Highly oriented graphite TPG and sealing/metallization technology ■ Solutions for temperature control and efficiency issues under severe conditions *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts

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